Ching-Kuan Lee, Jen-Chun Wang, Yu-Min Lin, C. Zhan, Wen-Wei Shen, H. Fu, Yuan-Chang Lee, C. Chiang, Su-Ching Chung, Su-Mei Chen, Chia-Wen Fan, Hsiang-Hung Chang, W. Lo, Yung Jean Lu
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引用次数: 1
Abstract
In this paper, we investigated the reliability test for Glass interposer. The test vehicle is assembled glass interposer with chip, BT substrate, and PCB. The structure of a glass interposer with two RDL on the front-side and one RDL on the backside had been evaluated and developed. Key technologies, including via fabrication, topside RDL formation, micro-bumping, temporary bonding, silicon and glass thinning and backside RDL formation, were developed and integrated to perform well. The BT substrate design and PCB for electrical characterization of reliability tests are included as well. The results indicate that the device with the glass interposer can be integrated and there is also data showing the feasibility of the glass interposer for electronics applications.
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