Effect of palladium on the mechanical properties of Cu and Cu-Al intermetallic compounds

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Pub Date : 2013-12-01 DOI:10.1109/EPTC.2013.6745727

A. B. Lim, Xin Long, Lu Shen, X. Chen, R. Ramanujan, C. Gan, Zhong Chen

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Abstract

There is a growing interest in copper (Cu) wire bonding due to its significant cost savings over gold wire. However, concerns on package reliability and corrosion susceptibility have driven the industry to develop alternative materials. Recently, palladium coated copper wire (Pd-Cu) wire has seen rapid entry into the market as it is believed to improve reliability of copper wire bonds on aluminum (Al) pads. However, the effect of palladium on the mechanical properties and corrosion resistance of Cu and Cu-Al intermetallics has not been studied in detail. In this paper, bulk alloys of Cu and Cu-Al with different concentrations of Pd were prepared under controlled conditions to simulate the intermetallics (IMC) formed between the copper ball bond and aluminum pads during bonding. Material properties such as elemental composition and phase formation were analyzed. Hardness and Young's modulus of the alloys were characterized by nanoindentation. It was observed that CuAl intermetallic is the hardest and stiffest. Palladium was observed to slightly increase the modulus and hardness of the alloys.

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钯对Cu和Cu- al金属间化合物力学性能的影响

由于铜(Cu)线比金线节省了大量的成本，因此对铜(Cu)线键合的兴趣越来越大。然而，对封装可靠性和腐蚀敏感性的担忧促使业界开发替代材料。最近，钯包覆铜线(Pd-Cu)线迅速进入市场，因为它被认为可以提高铝(Al)衬垫上铜线结合的可靠性。然而，钯对Cu和Cu- al金属间化合物力学性能和耐蚀性的影响尚未得到详细的研究。本文在可控条件下制备了不同Pd浓度的Cu和Cu- al块状合金，模拟了铜球键合过程中与铝焊盘之间形成的金属间化合物(IMC)。分析了材料的元素组成和相形成等性能。采用纳米压痕法对合金的硬度和杨氏模量进行表征。结果表明，金属间化合物CuAl最硬、最硬。钯的加入对合金的模量和硬度有轻微的提高。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

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