A realistic methodology for the worst case analysis of VLSI circuit performances

Sang-Hoon Lee, Kyung-Ho Kim, Jin-Kyu Park, Chang-hoon Choi, J. Kong, Won-Woo Lee, Wong-Seong Lee, Jei-Hwan Yoo, Sooin Cho
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引用次数: 3

Abstract

Summary form only given. Minimising the circuit layout feature size can lead to improved performance, but it may also reduce the manufacturing yield. The smaller dimensions increase the relative variability of the process and make the circuit sensitive to process fluctuations such as, photo mask, depo/etch and furnace. In order to produce circuit designs that are more robust, it is crucial for designers to verify that circuit performances meet specifications across the entire range of process fluctuations. The driving force of previous work has thus been to come up with a simple and effective worst case design. In this work, a new approach to the statistical worst case of full-chip circuits, using the Principal Component Analysis (PCA) and the Gradient Analysis (GA), is proposed and verified. This method enables designers not only to predict the standard deviations of circuit performance but also to track circuit performances associated with process shift by measuring e-tests. Experimental qualification of the method is described using a 0.25 /spl mu/m 256 Mbit DRAM.
VLSI电路性能最坏情况分析的现实方法
只提供摘要形式。最小化电路布局特征尺寸可以提高性能,但也可能降低制造成品率。较小的尺寸增加了工艺的相对可变性,并使电路对工艺波动(如光掩膜、沉积/蚀刻和炉)敏感。为了生产更健壮的电路设计,设计师验证电路性能是否满足整个工艺波动范围内的规格是至关重要的。因此,之前工作的驱动力是提出一个简单而有效的最坏情况设计。在这项工作中,提出并验证了一种使用主成分分析(PCA)和梯度分析(GA)的全芯片电路统计最坏情况的新方法。这种方法使设计人员不仅可以预测电路性能的标准偏差,还可以通过测量电子测试来跟踪与工艺位移相关的电路性能。采用0.25 /spl mu/m 256 Mbit DRAM对该方法进行了实验验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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