Electrical and thermal analysis for system-in-a package (SiP) implementation platform

Abstract

This paper presents an electrical and thermal performance analysis of system-in-a-package (SiP) memory/logic implementation platform based on chip-laminate-chip (CLC) technology. Internal IO interface inside CLC module has been modeled and compared with stack-chip (SC) implementation. Thermal analysis, including comparison against stack-chip and system-on- a-chip (SoC) is also presented. It is demonstrated that CLC technology provides significant performance advantage over conventional SiP technologies and has great impact on future system-level integration.