Kobi Hartley, J. Finney, S. Hodges, Peli De Halleux, J. Devine, Gabriele D'Amone
{"title":"MakeDevice: Evolving Devices Beyond the Prototype with Jacdac","authors":"Kobi Hartley, J. Finney, S. Hodges, Peli De Halleux, J. Devine, Gabriele D'Amone","doi":"10.1145/3569009.3573106","DOIUrl":null,"url":null,"abstract":"Embedded devices are now commonplace, and hardware prototyping toolkits have become a popular approach for hobbyists and professionals to create embedded hardware prototypes. However, moving from prototype into small scale manufacture use introduces complexity and cost, restricting embedded device development ’beyond the prototype’. Challenges include the need to design custom PCB for manufacture, and the design and fabrication of a device enclosure to ensure the robust enough for deployment. In response, we present MakeDevice : a web-based tool that leverages an existing modular hardware prototyping platform, Jacdac, to enable low-complexity route to generate a custom ‘carrier’ PCB upon which modules can be mounted and electrically connected. MakeDevice also automatically generates CAD files for custom enclosures with apertures to suit. We show how such enclosures can be generated using 3D printing and 2D stencils. In this way, MakeDevice lowers the barriers in moving from prototype to viable low-volume deployment of embedded hardware.","PeriodicalId":183744,"journal":{"name":"Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-02-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3569009.3573106","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Embedded devices are now commonplace, and hardware prototyping toolkits have become a popular approach for hobbyists and professionals to create embedded hardware prototypes. However, moving from prototype into small scale manufacture use introduces complexity and cost, restricting embedded device development ’beyond the prototype’. Challenges include the need to design custom PCB for manufacture, and the design and fabrication of a device enclosure to ensure the robust enough for deployment. In response, we present MakeDevice : a web-based tool that leverages an existing modular hardware prototyping platform, Jacdac, to enable low-complexity route to generate a custom ‘carrier’ PCB upon which modules can be mounted and electrically connected. MakeDevice also automatically generates CAD files for custom enclosures with apertures to suit. We show how such enclosures can be generated using 3D printing and 2D stencils. In this way, MakeDevice lowers the barriers in moving from prototype to viable low-volume deployment of embedded hardware.