MakeDevice: Evolving Devices Beyond the Prototype with Jacdac

Kobi Hartley, J. Finney, S. Hodges, Peli De Halleux, J. Devine, Gabriele D'Amone
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Abstract

Embedded devices are now commonplace, and hardware prototyping toolkits have become a popular approach for hobbyists and professionals to create embedded hardware prototypes. However, moving from prototype into small scale manufacture use introduces complexity and cost, restricting embedded device development ’beyond the prototype’. Challenges include the need to design custom PCB for manufacture, and the design and fabrication of a device enclosure to ensure the robust enough for deployment. In response, we present MakeDevice : a web-based tool that leverages an existing modular hardware prototyping platform, Jacdac, to enable low-complexity route to generate a custom ‘carrier’ PCB upon which modules can be mounted and electrically connected. MakeDevice also automatically generates CAD files for custom enclosures with apertures to suit. We show how such enclosures can be generated using 3D printing and 2D stencils. In this way, MakeDevice lowers the barriers in moving from prototype to viable low-volume deployment of embedded hardware.
MakeDevice:与Jacdac一起发展超越原型的设备
嵌入式设备现在很常见,硬件原型工具包已经成为业余爱好者和专业人士创建嵌入式硬件原型的流行方法。然而,从原型转移到小规模生产使用引入了复杂性和成本,限制了嵌入式设备的开发“超越原型”。挑战包括需要设计用于制造的定制PCB,以及设备外壳的设计和制造,以确保部署足够坚固。作为回应,我们提出MakeDevice:一个基于网络的工具,它利用现有的模块化硬件原型平台Jacdac,使低复杂性的路线能够生成定制的“载波”PCB,模块可以在其上安装和电连接。MakeDevice还自动生成CAD文件,用于定制具有孔径的外壳。我们展示了如何使用3D打印和2D模板生成这样的外壳。通过这种方式,MakeDevice降低了从原型到可行的小批量嵌入式硬件部署的障碍。
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