New methodology for on-chip RF reliability assessment

L. Heis, Andreas Lachmann, R. Schwab, G. Panagopoulos, Peter Baumgartner, Mamatha Yakkegondi Virupakshappaa, D. Schmitt-Landsiedel
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引用次数: 5

Abstract

This work presents a systematic approach to investigate transistor reliability at high frequencies with on-chip stress circuits. The problem of state-of-the art on-chip stress circuits is that the actual stress signal at the device cannot be verified by measurements. However, due to the exponential voltage dependency of transistor reliability mechanisms it is important to know the exact voltage of the generated stress signals. Therefore our RF reliability assessment methodology uses two test structures, one to generate AC stress signals on-chip and one to monitor these signals with an on-chip oscilloscope. The methodology is applied to study the frequency dependency of PBTI, NBTI and hot carrier degradation in a 28 nm high-k technology.
片上射频可靠性评估的新方法
这项工作提出了一种系统的方法来研究芯片上应力电路在高频下晶体管的可靠性。最先进的片上应力电路的问题是,设备上的实际应力信号无法通过测量来验证。然而,由于晶体管可靠性机制的指数电压依赖性,知道产生的应力信号的确切电压是很重要的。因此,我们的射频可靠性评估方法使用两种测试结构,一种用于在片上产生交流应力信号,另一种用于用片上示波器监测这些信号。应用该方法研究了28 nm高k技术中PBTI、NBTI和热载流子降解的频率依赖性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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