Al/SiC for power electronics packaging

Abstract

Al/SiC composites have a CTE that very closely matches ceramics along with a high thermal conductivity. In addition, these composites also have an elastic modulus that is 2/spl times/ that of Cu and a density that is 66% less than that of Cu. These properties allow for a package design that is significantly superior to the traditional Cu baseplate design. This presentation discusses the unique properties of Al/SiC as it applies to power electronics packaging. The results of thermal cycling and other reliability testing of Al/SiC products are presented and discussed.