Impact of HK / MG stacks and future device scaling on RTN

N. Tega, H. Miki, Z. Ren, C. D'Emic, Yu Zhu, D. Frank, M. Guillorn, Dae-gyu Park, W. Haensch, K. Torii
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引用次数: 26

Abstract

This work demonstrates the close relationship between device scaling and the threshold voltage variation (ΔVth) of random telegraph noise (RTN) in high-κ and metal gate (HK / MG) stacks. Statistical analysis clarifies that high temperature forming gas annealing can suppress the RTN ΔVth. And properly annealed HK FETs have smaller RTN ΔVth than SiON FETs, due mostly to fewer traps and partly to thinner inversion thickness in HK / MG stacks. Consequently, the influence of RTN on HK / MG gate stacks is less than that of random dopant fluctuation in the 22 nm generation. However, RTN may pose a difficult challenge for the 15 nm generation. In addition to the scaling dependence, we also find that characterizing hysteretic RTN behaviors due to RTN dependence on bias is essential to determine whether the observed RTN has an impact on SRAM operation or not.
HK / MG堆栈和未来设备缩放对RTN的影响
这项工作证明了器件缩放与高κ和金属栅极(HK / MG)堆叠中随机电报噪声(RTN)的阈值电压变化(ΔVth)之间的密切关系。统计分析表明,高温成形气体退火可以抑制RTN ΔVth。适当退火的HK fet的RTN ΔVth比SiON fet小,主要是由于陷阱较少,部分原因是HK / MG堆叠的反转厚度较薄。因此,RTN对HK / MG栅极堆叠的影响小于随机掺杂波动的影响。然而,RTN可能对15nm一代构成困难的挑战。除了尺度依赖性外,我们还发现表征RTN对偏置依赖性所导致的滞后RTN行为对于确定观察到的RTN是否对SRAM操作有影响至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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