Solder microstructure and intermetallic interface evaluation between Sn-3.5Ag-1.0Cu-xNi lead free solder under long time thermal aging (x: 0, 0.05, 0.2, 0.5)

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2012-11-01 DOI:10.1109/IEMT.2012.6521764

N. A. A. Ghani, I. Yahya, M. M. Salleh, S. Shamsuddin, Z. Ahmad, R. Mayappan

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Abstract

Sn-3.5Ag-1.0Cu-xNi (x: 0, 0.05, 0.2, 0.5) solder alloy has been developed to improve properties and microstructure of Sn-3.5Ag-1.0Cu based solder. The composite solder were synthesized via the powder metallurgy route which consist of blending, compacting and sintering process. The sintered solders were characterized for it melting temperature, SEM-EDX analysis was done to confirm the homogeneity of sample element distribution and X-Ray diffraction (XRD) analysis was conducted to see the presents of some phases. XRD analysis of sintered sample showed the presents of Ni3Sn4 and Ni3Sn2 phases. Solders were melted on copper substrate at 250°C for one minute on hot plate and aged at 150°C from 0 to 400 hours. The microstructure of the solder and the growth of IMC formation were studied under Scanning Electron Microscope (SEM) and EDX. The phases formed were studied under SEM-EDX. The SEM results show the presence of Cu6Sn5, Cu3Sn and Ag3Sn intermetallic in the Sn-3.5Ag-1.0Cu solder and Sn-3.5Ag-1.0Cu-xNi solder.

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长时间热时效(x: 0、0.05、0.2、0.5)下Sn-3.5Ag-1.0Cu-xNi无铅焊料的钎料微观结构及金属间界面评价

为改善Sn-3.5Ag-1.0Cu基钎料的性能和组织，研制了Sn-3.5Ag-1.0Cu- xni (x: 0,0.05, 0.2, 0.5)钎料合金。采用粉末冶金工艺，经过共混、压实和烧结工艺合成了复合钎料。用SEM-EDX分析样品元素分布的均匀性，用x射线衍射(XRD)分析部分相的形貌。烧结试样的XRD分析表明，烧结试样中存在Ni3Sn4和Ni3Sn2相。焊料在铜衬底上250℃热板上熔化1分钟，150℃时效0 ~ 400小时。利用扫描电镜(SEM)和电子能谱(EDX)研究了钎料的显微组织和IMC的生长情况。在SEM-EDX下对所形成的相进行了研究。SEM结果表明，Sn-3.5Ag-1.0Cu钎料和Sn-3.5Ag-1.0Cu- xni钎料中存在Cu6Sn5、Cu3Sn和Ag3Sn金属间化合物。

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2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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