Study on Stress and Reliability of Advanced Intelligent Power Module (IPM) Subjected to Power Cycling

Abstract

In this study, intelligent power module (IPM) with body size of $40\text{mm}\times 40\text{mm}$ is developed and its stress and reliability are investigated through finite element analysis (FEA) considering power cycling loading condition. Mechanical modeling and simulation for IPM package subjected to power cycling are conducted to help material selection such as epoxy molding compound (EMC), thermal interface material (TIM) and die attach (DA). To improve solder joint reliability and reduce package stress, parametric study on material selection is conducted including 6 EMC, 4 DA, and 4 TIM materials. Final material selection is recommended for IPM test vehicle based on FEA simulation results.