3D composite photonic interposer integrated with low-cost silicon nitride optical interconnects

Abstract

We demonstrate our efforts in design and fabrication toward a 3D composite glass-silicon photonic interposer which integrated with silicon nitride waveguides for high-capacity and low-cost on-interposer optical interconnects. By using borosilicate glass as silicon nitride waveguide bottom cladding, low-cost and robust 3D composite photonic interposer can be realized for high-performance optoelectronic and MEMS packaging applications.