Epoxy Mold Compound Curing Behavior and Mold Process Cure Time Interaction on Molded Package Performance

Abstract

Epoxy mold compound curing behavior is a fundamental material property which affects the molding process and molded package performance. This paper aims to understand the effect of different cure time settings at isothermal conditions on mold compound material properties, molding process, and package quality and reliability through material characterization, thermal analysis, moldability, delamination response, package bending strength measurements and reliability testing. Overall results showed that longer mold cure time results to an increase in curing density due to better crosslinking of the epoxy-resin network and corresponds to improved mechanical properties and adhesion. Package delamination response and bending strength also improved with longer cure time. Moisture absorption and reliability were not affected by the different mold cure time settings after PMC was applied during assembly process. Understanding the interaction of mold compound curing behavior and optimum molding cure time parameter on molded package performance results to significant manufacturing productivity and equipment capacity improvement without sacrificing desired material properties, package integrity and reliability.