Fault isolation of die level crystal defect failure mechanism through OBIRCH analysis and micro-probing

Abstract

Generally, crystal defect is able to induce photon emission event for detection by emission microscopy (EMMI) equipment. However, due to thick, dense metallization and high doped substrate, effective detection by EMMI alone is not always reliable. Thus, further isolation, layout information and verification are required through OBIRCH analysis, CAD navigation and micro-probing sequence respectively.