A review of IBM sponsored research and development projects for computer cooling

R. C. Chu
{"title":"A review of IBM sponsored research and development projects for computer cooling","authors":"R. C. Chu","doi":"10.1109/STHERM.1999.762443","DOIUrl":null,"url":null,"abstract":"This paper provides a review of twenty-five years of IBM sponsored research at universities intended to advance basic heat transfer technology for application in cooling computers. The research discussed covers a broad range of heat transfer topics, including natural convection and forced convection air cooling. Liquid forced convection, pool boiling, falling films, flow boiling, and liquid jet impingement. Examples of actual IBM cooling applications related to some of the research are given. In addition, some of the development activities conducted within IBM to advance computer cooling technology are highlighted. Specific topics covered are direct liquid cooling, thermal conduction module (TCM) cooling, low temperature cooling, and special cooling technology.","PeriodicalId":253023,"journal":{"name":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.1999.762443","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 21

Abstract

This paper provides a review of twenty-five years of IBM sponsored research at universities intended to advance basic heat transfer technology for application in cooling computers. The research discussed covers a broad range of heat transfer topics, including natural convection and forced convection air cooling. Liquid forced convection, pool boiling, falling films, flow boiling, and liquid jet impingement. Examples of actual IBM cooling applications related to some of the research are given. In addition, some of the development activities conducted within IBM to advance computer cooling technology are highlighted. Specific topics covered are direct liquid cooling, thermal conduction module (TCM) cooling, low temperature cooling, and special cooling technology.
回顾IBM赞助的计算机冷却研究和开发项目
本文回顾了25年来IBM赞助的大学研究,旨在推进用于冷却计算机的基本传热技术的应用。所讨论的研究涵盖了广泛的传热主题,包括自然对流和强制对流空气冷却。液体强制对流,池沸腾,落膜,流动沸腾,液体射流撞击。给出了与某些研究相关的实际IBM冷却应用的示例。此外,还强调了IBM内部为推进计算机冷却技术而进行的一些开发活动。具体主题包括直接液冷,热传导模块(TCM)冷却,低温冷却和特殊冷却技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信