JEDEC "TCR" interlaboratory experiment-lessons learned

Abstract

Describes the results of an interlaboratory experiment involving wafer-level measurements intended to do the following: 1) to determine the precision and bias of both the JEDEC Standard Test Method (JESD33) for determining the temperature coefficient of resistance (TCR) and joule heating of a metal line and the ASTM standard (F1261) for measuring the electrical width of a metal line; 2) to assess the reproducibility of measuring the temperature drop across the interface between the silicon substrate and the hot chuck; and 3) to obtain a temperature calibration of the hot chucks used by the participating laboratories.