Electro-kinetic microchannel cooling system for desktop computers

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-11 DOI:10.1109/STHERM.2004.1291297

P. Zhou, J. Hom, G. Upadhya, K. Goodson, M. Munch

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引用次数: 21

Abstract

The requirements for thermal management in high performance desktop computers are rapidly outpacing the capabilities of the best commercially available active and passive air cooling solutions. The problem lies in three compounding trends: a) higher average chip power density, b) higher peak power densities in chip hotspots, and c) more stringent system boundary conditions. Pumped liquid cooling system is a promising alternative to address these thermal management challenges. We present here an electro-kinetic microchannel cooling system for desktop computers that can handle average power density greater than 150 W/cm/sup 2/ and hotspots with peak power densities on the order of 500 W/cm/sup 2/ and above. The cooling system features a microchannel heat exchanger for high heat flux removal capability, an electrokinetic pump for delivering fluid at the required flow rate and pressure drop, and a liquid-air heat exchanger. The microchannel heat exchanger is well suited for hotspot cooling on microprocessors, and the solid-state electro-kinetic pump is silent, compact, and promises high reliability through its lack of moving parts. This manuscript describes simulations and experiments on a system prototype, which, when fully integrated, fits well within the boundary conditions required for high performance desktop computers.

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台式电脑电动微通道冷却系统

高性能台式计算机对热管理的要求正在迅速超过商业上最好的主动和被动空气冷却解决方案的能力。问题在于三个复合趋势:a)更高的平均芯片功率密度，b)更高的芯片热点峰值功率密度，以及c)更严格的系统边界条件。泵送液体冷却系统是解决这些热管理挑战的一个有前途的替代方案。我们在这里提出了一种用于台式计算机的电动微通道冷却系统，该系统可以处理平均功率密度大于150 W/cm/sup 2/和峰值功率密度为500 W/cm/sup 2/及以上的热点。该冷却系统具有一个具有高热流通量去除能力的微通道热交换器，一个以所需流速和压降输送流体的电动泵，以及一个液体-空气热交换器。微通道热交换器非常适合微处理器的热点冷却，固态电动泵安静，紧凑，并且由于缺乏运动部件而保证高可靠性。本文描述了系统原型的模拟和实验，当完全集成时，可以很好地满足高性能台式计算机所需的边界条件。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)

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