Computational enablement for designs with sub-20nm metal tip to tip using cut shapes from grapho-epitaxy directed self-assembly

B. Meliorisz, K. Lai, U. Welling, H. Stock, S. Marokkey, T. Muelders, Jing Sha, Chi-Chun Liu, C. Chi, Jing Guo, C. Osborn, J. Morillo, W. Demmerle, D. Dunn
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Abstract

This paper presents a design and technology co-optimization (DTCO) study of metal cut formation in the sub-20-nmregime. We propose to form the cuts by applying grapho-epitaxial directed self-assembly. The construction of a DTCO flow is explained and results of a process variation analysis are presented. We examined two different DSA models and evaluated their performance and speed tradeoff. The applicability of each model type in DTCO is discussed and categorized.
利用石墨外延定向自组装的切割形状,实现20纳米以下金属尖端到尖端的设计计算能力
本文提出了一种设计与技术协同优化(DTCO)方法,用于研究亚20nm区域的金属切削地层。我们建议采用石墨外延定向自组装来形成切口。介绍了DTCO流程的构造,并给出了过程变化分析的结果。我们检查了两种不同的DSA模型,并评估了它们的性能和速度权衡。对各种模型类型在DTCO中的适用性进行了讨论和分类。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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