Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC

Abstract

In this paper, heat transfer in 3D IC system is investigated using practical and novel materials for Inter Layer Dielectric (ILD) and Thermal Through Silicon Vias (TTSV). The currently used SiO2 ILD is amiss for heat mitigation due to its poor thermal conductivity. The unique thermal and electrical properties of Hexagonal Boron Nitride (h-BN) are explored in this work for improved heat mitigation.