Room temperature bonding of electroplated Au patterns with atomically smooth surface prepared by a replication process using a sacrificial layer

Abstract

We demonstrate a replication process of a surface shape from an atomically smooth master substrate onto electroplated Au patterns by a lift-off process using a thin sacrificial layer. An atomically smooth Au surface with a root mean square surface roughness of 0.8 nm could be created by the process. We also examined its applicability to room-temperature Au-Au bonding in air. A high bonding strength of about 250 MPa was obtained.