A balanced High Voltage IGBT design with ultra dynamic ruggedness and area-efficient edge termination

Ze Chen, Katsumi Nakamura, A. Nishii, T. Terashima, T. Kawakami
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引用次数: 12

Abstract

In this paper, a balanced High Voltage (HV) IGBT is presented. The proposed HV IGBT is composed of three technologies: Wide Cell Pitch CSTBTTM(III) for cell structure, Partial P collector utilizing LPT(II) buffer for vertical structure, and a novel area-efficient edge termination design. We called the above edge termination design “Linearly-narrowed Field Limiting Ring (LNFLR)”. The experiment results of a balanced 4500 V class IGBT show that the device maintains an excellent dynamic ruggedness with a 50% cut in edge termination width comparing to the conventional Field Limiting Ring (FLR) design. Moreover, optimizing fabrication process can further widen the process window for LNFLR dose.
一个平衡的高压IGBT设计,具有超动态的坚固性和面积高效的边缘终端
本文设计了一种平衡式高压IGBT。提出的HV IGBT由三种技术组成:用于单元结构的宽单元间距CSTBTTM(III),用于垂直结构的利用LPT(II)缓冲器的部分P集热器,以及一种新颖的面积高效边缘终端设计。我们将上述边缘终端设计称为“线性窄场限制环(LNFLR)”。4500v级平衡IGBT的实验结果表明,与传统的限域环(FLR)设计相比,该器件在边缘终端宽度减少50%的情况下保持了良好的动态坚固性。此外,优化制备工艺可以进一步拓宽LNFLR剂量的工艺窗口。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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