Electrical Properties of As-Deposited ALD HfO2 Films Related to Silicon Surface State

C. Cobianu, F. Năstase, N. Dumbravescu, O. Buiu, A. Albu, Bogdan Serbanl, M. Danila, C. Romanițan, O. Ionescu
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引用次数: 1

Abstract

In this paper, we present an experimental study of the electrical properties of the as-deposited HfO2films obtained by atomic layer deposition (ALD) method from tetrakis dimethylamino hafnium and water vapors at 200°C as a function of the silicon substrate preparation, in terms of Si-H and Si-OH terminated surfaces. High frequency C- V characteristics have proven that relatively higher effective dielectric constant, lower fixed charge at the Si-HfO2 interface and lower oxide trapped charge were obtained on MOS capacitors with HfO2 dielectric performed on Si-OH terminated Si surface with respect Si-H terminated surface, proving a more robust Si-O-Hf interface with respect to Si-Hf-O interface.
沉积ALD HfO2薄膜电学性能与硅表面态的关系
在本文中,我们对原子层沉积法(ALD)在200°C下从四甲基二甲胺铪和水蒸气中获得的沉积hfo2薄膜的电学性质进行了实验研究,以Si-H和Si-OH端部表面为例,研究了硅衬底制备的函数。高频C- V特性证明,相对于Si- h端面,在Si- oh端面进行HfO2介电的MOS电容器获得了相对较高的有效介电常数、较低的Si-HfO2界面固定电荷和较低的氧化物捕获电荷,证明了相对于Si- hf - o界面具有更强的Si- o - hf界面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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