N. Rezzak, E. Zhang, M. Alles, peixiong zhao, H. Hughes
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引用次数: 14
Abstract
The high body doping inherent in sub-100 nm partially-depleted SOI devices tends to mitigate the sensitivity to TID-induced leakage, providing that the doping reaches the STI sidewalls and back channel. Measured TID response on 45 nm NMOS SOI is consistent with trends observed in simulations.