Uncured ELK as a chemical mechanical planarization stop layer in Cu/XLK interconnect

Abstract

A novel approach of copper CMP stop layer using uncured extreme low-K was demonstrated to improve the within-wafer Rs uniformity on Cu/extra low-k (XLK) interconnect. This CMP stop layer could be converted into a low dielectric constant film by removing porogen with post CMP treatment, hence its impact on overall's film capacitance is minimized.