Reliability of stack packaging varying the die stacking architectures for flash memory applications

Abstract

Thermal analysis on various die stacking architectures, which are commonly employed in semiconductor flash products shows that thermal issues are not dominant for stack die configuration and leads to study the effect of combined thermo-mechanical and mechanical stresses. As there are existence of multiple die and other material with different CTEs, thermo-mechanical loading and its effect on reliability needs to be studied for optimum package design and die configuration