Fault Isolation of Die-to-Die Communication Error Failure

Abstract

This paper presented two real cases on the fault isolation of die-to-die communication error failure. A new method was introduced to maintain backside accessibility while the interbonding signals can be measured from front side. Based on the interbonding signal failing symptom, customized functional Optical Beam Induced Resistance Change(OBIRCH) or Photon Emission Microscopy(PEM) analysis proved to be very efficient for the fault isolation.