Built-in passive components in multilayer ceramics for wireless applications

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI:10.1109/ISAPM.1997.581261

C. Nelson, R. Sigliano, C. Makihara

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引用次数: 5

Abstract

Operating frequencies required for today's wireless telecommunication electronics have increased from hundreds of megahertz to a few gigahertz (GHz). The use of the GHz band is successful in the wireless market because passive and active components in microwave integrated circuits (MIC) or monolithic microwave integrated circuits (MMIC) packages meet the need for high performance and lower cost. There are still a few technical problems that need to be resolved in these packages. Among these is that high Q inductors and capacitors cannot be built cost effectively in the sizes required. Technological developments have yielded newer low temperature cofiring sintered glass ceramic materials incorporating integrated passive components cost effectively. These integrated components include inductors, capacitors, impedance matching SAW filter circuits and band pass filters. This presentation describes the development of this material and design of a test vehicle to determine suitability to high frequency wireless applications.

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用于无线应用的多层陶瓷内置无源元件

今天的无线通信电子设备所需的工作频率已经从几百兆赫兹增加到几千兆赫兹。GHz频段的使用在无线市场上是成功的，因为微波集成电路(MIC)或单片微波集成电路(MMIC)封装中的无源和有源组件满足了高性能和低成本的需求。在这些软件包中仍有一些技术问题需要解决。其中之一是，高Q电感器和电容器不能以所需的尺寸成本有效地建造。技术的发展已经产生了新的低温共烧烧结玻璃陶瓷材料，其中集成了低成本的被动元件。这些集成组件包括电感、电容器、阻抗匹配SAW滤波器电路和带通滤波器。本报告描述了这种材料的开发和测试车辆的设计，以确定其是否适合高频无线应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

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