Coupling surface temperature scanning and ultra-fast adaptive computing to thermally fully characterize complex three-dimensional electronic devices

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI:10.1109/STHERM.2006.1625229

P. Raad, P. Komarov, M. Burzo

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引用次数: 8

Abstract

A novel analysis engine and experimental system capable of fully characterizing the thermal behavior of complex three-dimensional active submicron electronic devices is introduced in this article. First, the thermoreflectance thermography (TRTG) system is used to measure the 2D surface temperature field of a pulsed device, noninvasively and with submicron spatial resolution. Next, the thermal conductivity of each thin-film layer composing the device is measured and a numerical model is built using measured and known values. The temperature distribution map is then used as input for an ultrafast inverse computational solution to fully characterize the thermal behavior of the complex three-dimensional device under study. By bringing together measurement and computation, it becomes possible for the first time to noninvasively extract the three-dimensional thermal behavior of nanoscale embedded features that cannot otherwise be accessed. The power of the method is demonstrated by verifying that it can extract details of interest of a representative CMOS device

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耦合表面温度扫描和超快速自适应计算热充分表征复杂的三维电子器件

本文介绍了一种能够全面表征复杂三维有源亚微米电子器件热行为的新型分析引擎和实验系统。首先，利用热反射热成像(TRTG)系统测量脉冲器件的二维表面温度场，该系统具有亚微米空间分辨率，无创。接下来，测量组成器件的每个薄膜层的导热系数，并使用测量值和已知值建立数值模型。然后将温度分布图用作超快速反计算解的输入，以充分表征所研究的复杂三维器件的热行为。通过将测量和计算结合在一起，首次可以无创地提取纳米级嵌入特征的三维热行为，否则无法访问。通过验证该方法可以提取具有代表性的CMOS器件的感兴趣的细节，证明了该方法的有效性

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium

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