Effects of Testing Conditions and Multiple Reflows on Cold Bump Pull Test of Pb-free Solder Balls

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI:10.1109/ICEPT.2005.1564698

F. Song, S. Lee

{"title":"Effects of Testing Conditions and Multiple Reflows on Cold Bump Pull Test of Pb-free Solder Balls","authors":"F. Song, S. Lee","doi":"10.1109/ICEPT.2005.1564698","DOIUrl":null,"url":null,"abstract":"Ball pull test has emerged to be an attractive alternative to the traditional ball shear testing method for characterizing the attachment strength of solder interconnection. Since this is a relatively new development, so far there is no industrial standard to regulate this testing method. In this study, the pull and shear tests are performed on plastic ball grid array (PBGA) solder balls with Sn-4.0Ag-0.5Cu and Sn-37Pb solders, subject to a wide variety of testing conditions. To investigate the material sensitivity of Sn-Ag-Cu and Sn-Pb solder balls, different pull speeds are used on both kinds of solder balls for comparison. The pull speed ranges from 25 mum/s to 5000 mum/s, while the shear speed ranges from 25 mum/s to 500 mum/s. The pull and shear tests are also conducted on samples with Sn-Ag-Cu and Sn-Pb solder balls after multiple reflows. Various failure modes of ball shear and ball pull tests are discussed for comparison. The sensitivity of both methods on brittle interface fracture is addressed. Furthermore, different pull speeds are applied to Pb-free solder samples after multi-reflows. Favorable testing conditions will be recommended","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"61 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 6th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2005.1564698","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 9

Abstract

Ball pull test has emerged to be an attractive alternative to the traditional ball shear testing method for characterizing the attachment strength of solder interconnection. Since this is a relatively new development, so far there is no industrial standard to regulate this testing method. In this study, the pull and shear tests are performed on plastic ball grid array (PBGA) solder balls with Sn-4.0Ag-0.5Cu and Sn-37Pb solders, subject to a wide variety of testing conditions. To investigate the material sensitivity of Sn-Ag-Cu and Sn-Pb solder balls, different pull speeds are used on both kinds of solder balls for comparison. The pull speed ranges from 25 mum/s to 5000 mum/s, while the shear speed ranges from 25 mum/s to 500 mum/s. The pull and shear tests are also conducted on samples with Sn-Ag-Cu and Sn-Pb solder balls after multiple reflows. Various failure modes of ball shear and ball pull tests are discussed for comparison. The sensitivity of both methods on brittle interface fracture is addressed. Furthermore, different pull speeds are applied to Pb-free solder samples after multi-reflows. Favorable testing conditions will be recommended

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试验条件和多次回流对无铅焊锡球冷凸拉试验的影响

对于表征焊料互连的附着强度，球拉试验已成为传统球剪切试验方法的一种有吸引力的替代方法。由于这是一个比较新的发展，目前还没有行业标准来规范这种检测方法。在本研究中，采用Sn-4.0Ag-0.5Cu和Sn-37Pb焊料对PBGA(塑料球栅阵列)焊料球进行了拉伸和剪切试验，试验条件多种多样。为了研究Sn-Ag-Cu和Sn-Pb钎料球的材料敏感性，对两种钎料球采用不同的拉速进行比较。拉拔速度范围为25 ~ 5000 mum/s，剪切速度范围为25 ~ 500 mum/s。对Sn-Ag-Cu和Sn-Pb钎料球试样进行了多次回流后的拉剪试验。讨论了球剪和球拉试验的各种破坏模式，并进行了比较。讨论了两种方法对界面脆性断裂的敏感性。此外，不同的拉速适用于多次回流后的无铅焊料样品。将推荐有利的测试条件

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2005 6th International Conference on Electronic Packaging Technology

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