Effect of microstructure on electrical and mechanical properties: Impurities of inkjet-printed Ag and Cu interconnects

Abstract

Inkjet printing technology is a pattern-on-demand technology which has numerous advantages. However, this technology needs an additional thermal treatment, i.e., drying process. This treatment results in microstructure evolution which is expected to relate to properties of film. The microstructure, electrical and mechanical properties of the inkjet printed Ag and Cu films were characterized as drying process. Model study on electrical resistivity of Ag film shows that the decomposition of capping molecule plays a key role in microstructure evolution and electrical resistivity. The effect of ambient in thermal treatment of inkjet printed Cu film also investigated in this purport. The adhesion strength as a mechanical property was measured by 4 point bend test using sandwiched structure. Strengthening of adhesion was observed as densification of inkjet printed film.