Supply chains for 3D IC integration manufacturing

Abstract

The supply chains for 3D IC integration manufacturing are studied in this investigation. Emphasis is placed on the ownerships of the technology supply chains such as the FEOL (front-end-of-line), MOL (middle-of-the-line), BEOL (back-end-of-line), TSV (through-silicon via), MEOL (middle-end-of-line), and package assembly and test. Some recommendations will be provided.