R. Moazzami, P. Maniar, R. Jones, A. C. Campbell, C. Mogab
{"title":"Ultra-high charge storage capacity ferroelectric lead zirconate titanate thin films for gigabit-scale DRAM's","authors":"R. Moazzami, P. Maniar, R. Jones, A. C. Campbell, C. Mogab","doi":"10.1109/IEDM.1992.307519","DOIUrl":null,"url":null,"abstract":"This paper describes an investigation of thickness scaling of sol gel-derived ferroelectric lead zirconate titanate (PZT) thin films that demonstrates the highest charge storage capacity (220 fC/ mu m/sup 2/ for a 1.5 V voltage swing) ever reported, low leakage current density (<10-7 A/cm/sup 2/ at 0.75 V for V/sub DD//2 operation), and good dielectric integrity. V/sub DD//2 operation is also shown to be viable with these ferroelectric films since no fatigue is observed after 10/sup 11/ polarization reversals. These PZT films hold promise as an alternative to the conventional trench and stacked capacitor cell technologies employing SiO/sub 2//Si/sub 3/N/sub 4/ dielectrics which demand extremely severe geometries and exceedingly complex processes to meet the charge storage specifications of gigabit-scale DRAM's.<<ETX>>","PeriodicalId":287098,"journal":{"name":"1992 International Technical Digest on Electron Devices Meeting","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 International Technical Digest on Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.1992.307519","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11
Abstract
This paper describes an investigation of thickness scaling of sol gel-derived ferroelectric lead zirconate titanate (PZT) thin films that demonstrates the highest charge storage capacity (220 fC/ mu m/sup 2/ for a 1.5 V voltage swing) ever reported, low leakage current density (<10-7 A/cm/sup 2/ at 0.75 V for V/sub DD//2 operation), and good dielectric integrity. V/sub DD//2 operation is also shown to be viable with these ferroelectric films since no fatigue is observed after 10/sup 11/ polarization reversals. These PZT films hold promise as an alternative to the conventional trench and stacked capacitor cell technologies employing SiO/sub 2//Si/sub 3/N/sub 4/ dielectrics which demand extremely severe geometries and exceedingly complex processes to meet the charge storage specifications of gigabit-scale DRAM's.<>