Thermo-mechanical simulation of BCB membrane thin-film package

Abstract

This paper presents the investigation of the behaviour of BCB thin-film package based on the ANSYS FEM analysis. This kind of zero-level packaging has some stress effects on a packaged device causing deformation of chip and package cap itself. BCB cap deformation and device chip deformation as a function of its residual stress are significant due to the reliablity of the packaged devices. It was found that the deformation of the two parameters worsened as BCB residual stress increases. In addition, the BCB package deformation will be presented as a function of some physical parameters of the package such as BCB sealing ring width, BCB sealing ring height and BCB membrane height.