Modeling Assisted Room Temperature Operation of Atomic Precision Advanced Manufacturing Devices

Xujiao Gao, L. Tracy, E. Anderson, Deanna Campbell, J. Ivie, T. Lu, D. Mamaluy, S. Schmucker, S. Misra
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引用次数: 4

Abstract

One big challenge of the emerging atomic precision advanced manufacturing (APAM) technology for microelectronics application is to realize APAM devices that operate at room temperature (RT). We demonstrate that semiclassical technology computer aided design (TCAD) device simulation tool can be employed to understand current leakage and improve APAM device design for RT operation. To establish the applicability of semiclassical simulation, we first show that a semiclassical impurity scattering model with the Fermi-Dirac statistics can explain the very low mobility in APAM devices quite well; we also show semiclassical TCAD reproduces measured sheet resistances when proper mobility values are used. We then apply semiclassical TCAD to simulate current leakage in realistic APAM wires. With insights from modeling, we were able to improve device design, fabricate Hall bars, and demonstrate RT operation for the very first time.
建模辅助原子精密先进制造设备的室温操作
原子精密先进制造(APAM)技术在微电子领域的应用面临的一大挑战是如何实现在室温下工作的APAM器件。我们证明了半经典技术计算机辅助设计(TCAD)器件仿真工具可以用于了解电流泄漏和改进RT操作的APAM器件设计。为了建立半经典模拟的适用性,我们首先证明了具有费米-狄拉克统计量的半经典杂质散射模型可以很好地解释APAM器件中的极低迁移率;我们还表明,当使用适当的迁移率值时,半经典TCAD再现了测量的薄片电阻。然后,我们应用半经典TCAD来模拟实际APAM导线中的漏电流。通过建模的见解,我们能够改进设备设计,制造霍尔酒吧,并首次演示RT操作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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