A Critical Gate Voltage Triggering Irreversible Gate Dielectric Degradation

V. Lo, K. Pey, C. Tung, D. Ang
{"title":"A Critical Gate Voltage Triggering Irreversible Gate Dielectric Degradation","authors":"V. Lo, K. Pey, C. Tung, D. Ang","doi":"10.1109/RELPHY.2007.369958","DOIUrl":null,"url":null,"abstract":"Using a multiple-stage constant-voltage stress (M-CVS) methodology, a critical gate voltage (V<sub>crit</sub>) is found to demarcate the post-breakdown (BD) gate leakage current (I<sub>g</sub>) evolution. For a gate voltage (V<sub>g</sub>) < V<sub>crit</sub>, I<sub>g</sub> digitally fluctuates with no apparent net increase. For V<sub>g</sub> > V<sub>crit</sub>, I<sub>g</sub> rapidly evolves into a stable high leakage state. V<sub>crit</sub> is found to decrease with decreasing oxide thickness (T<sub>ox</sub>), implying that it has a significant impact on I<sub>g</sub> degradation rate (dl<sub>g</sub>/dt) (Lombardo, 2003) at nominal operating voltages.","PeriodicalId":433104,"journal":{"name":"2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.2007.369958","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12

Abstract

Using a multiple-stage constant-voltage stress (M-CVS) methodology, a critical gate voltage (Vcrit) is found to demarcate the post-breakdown (BD) gate leakage current (Ig) evolution. For a gate voltage (Vg) < Vcrit, Ig digitally fluctuates with no apparent net increase. For Vg > Vcrit, Ig rapidly evolves into a stable high leakage state. Vcrit is found to decrease with decreasing oxide thickness (Tox), implying that it has a significant impact on Ig degradation rate (dlg/dt) (Lombardo, 2003) at nominal operating voltages.
触发不可逆栅介电退化的临界栅电压
使用多级恒压应力(M-CVS)方法,找到了一个临界栅极电压(Vcrit)来划分击穿后(BD)栅极泄漏电流(Ig)的演变。对于栅极电压(Vg) < Vcrit, Ig数字波动没有明显的净增加。当Vg > Vcrit时,Ig迅速演化为稳定的高泄漏状态。Vcrit随着氧化物厚度(Tox)的减小而减小,这意味着在标称工作电压下,Vcrit对Ig降解率(dlg/dt)有显著影响(Lombardo, 2003)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信