Flip-chip-in-a-package solder joint reliability simulation

Abstract

The thermomechanical failure of solder joints in semiconductor packages is a critical issue in flip-chip applications. With their low melting point, solder joints can creep even at room temperature. When the accumulated plastic strain energy in the solder reaches a critical level during thermal cycling, cracking occurs and the solder joints can fail under further cycling. The thermomechanical reliability of a generic flip-chip semiconductor package was studied using computer simulations. In this study, the test vehicle was a flip-chip package with solder bumps. In order to accurately capture the flip-chip solder joint stress conditions, a submodeling simulation technique was employed.