{"title":"Numerical tools for fracture of MEMS devices","authors":"N. Tayebi, A. Tayebi, Y. Belkacemi","doi":"10.1109/GLSV.1999.757432","DOIUrl":null,"url":null,"abstract":"Numerical tools to model fracture in MEMS devices are proposed. The two procedures are the Element Free method and the Displacement Discontinuity Method. Experiments on MEMS fracture are used to evaluate the numerical procedures. The test specimens covered a range of geometries and designs, including notches, holes and corners. For some specimens both methods gave acceptable results compared to experiments (Ballarini et al. and Suwito), while for others results were off by more than 15%. These findings raise new questions about the applicability of linear elastic fracture mechanics to model failure of MEMS devices at the microscopic scale.","PeriodicalId":127222,"journal":{"name":"Proceedings Ninth Great Lakes Symposium on VLSI","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings Ninth Great Lakes Symposium on VLSI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GLSV.1999.757432","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Numerical tools to model fracture in MEMS devices are proposed. The two procedures are the Element Free method and the Displacement Discontinuity Method. Experiments on MEMS fracture are used to evaluate the numerical procedures. The test specimens covered a range of geometries and designs, including notches, holes and corners. For some specimens both methods gave acceptable results compared to experiments (Ballarini et al. and Suwito), while for others results were off by more than 15%. These findings raise new questions about the applicability of linear elastic fracture mechanics to model failure of MEMS devices at the microscopic scale.
提出了用于模拟MEMS器件断裂的数值工具。这两种方法分别是无单元法和位移不连续法。采用MEMS断裂实验对数值计算方法进行了验证。测试样本涵盖了一系列的几何形状和设计,包括缺口、孔和角。与实验相比,对于某些标本,两种方法都给出了可接受的结果(Ballarini et al. and Suwito),而对于其他标本,结果偏差超过15%。这些发现对线弹性断裂力学在微观尺度上模拟MEMS器件失效的适用性提出了新的问题。