Novel designs of 4H-SiC trench gate metal-oxide-semiconductor field effect transistors (UMOSFETs) with low on-resistance

Kai Tian, Jindou Liu, Jing Cui, Chuangji Zhou, Anping Zhang
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引用次数: 7

Abstract

In this paper novel 4H-SiC UMOSFETs structures with n-type wrapping region and superjunctions are proposed to reduce on-resistance while maintaining breakdown voltage. In the proposed 4H-SiC UMOSFETs structure an n-type region is created to wrap the p+ shielding region at the bottom of the trench gate. The on-resistances of the optimized 4H-SiC UMOSFETs and the conventional one are 2.31mΩ-cm2 and 3.56 mΩ-cm2 at VGS=15 V and VDS=10 V respectively. The on-resistance and the FOM (figure of merit = VBR2/Ron) improve by 35.1% and 37.3% respectively. By introducing a current spreading layer (CSL)the on-resistance of the optimized 4H-SiC UMOSFETs with superjunctions is 6.03mΩ-cm2 compared with 17.36 mΩ-cm2 for the conventional structure. The FOM of the optimized device with CSL is improved by 110.4% compared with the conventional one with same doping concentration.
低导通电阻4H-SiC沟槽栅金属氧化物半导体场效应晶体管(umosfet)的新设计
为了在保持击穿电压的同时降低导通电阻,本文提出了一种具有n型包绕区和超结的新型4H-SiC umosfet结构。在提出的4H-SiC umosfet结构中,创建了一个n型区域来包裹在沟槽栅极底部的p+屏蔽区域。优化后的4H-SiC umosfet在VGS=15 V和VDS=10 V时的导通电阻分别为2.31mΩ-cm2和3.56 mΩ-cm2。导通电阻和FOM(性能值= VBR2/Ron)分别提高了35.1%和37.3%。通过引入电流扩展层(CSL),优化后具有超结的4H-SiC umosfet的导通电阻为6.03mΩ-cm2,而传统结构的导通电阻为17.36 mΩ-cm2。与相同掺杂浓度的常规器件相比,优化后的CSL器件的FOM提高了110.4%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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