Metal-based Direct Multi-jet Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI:10.1109/EuroSimE56861.2023.10100758

Reza Moloudi, T. Grün, Willem Verleysen, B. Vandevelde, S. G. Cleuren, D. May, B. Wunderle

引用次数: 0

Abstract

A metal 3D-printed high performance multi-jet impingement cooling solution for enabling thermal management of high-power electronics is presented for level-5 autonomous driving. In this paper, we describe the concept, metal 3D printing fabrication and experimental characterization to demonstrate the proof-of-concept of direct liquid cooling of high-power components dissipating up to 300 W.

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用于自动驾驶高性能车载计算机(HPVC)的金属基直接多射流冲击冷却解决方案

一种金属3d打印高性能多射流冲击冷却解决方案，可用于5级自动驾驶的高功率电子设备的热管理。在本文中，我们描述了概念，金属3D打印制造和实验表征，以展示耗散高达300 W的大功率组件的直接液冷的概念验证。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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