{"title":"3D integration applications for low temperature direct bond technology","authors":"P. Enquist","doi":"10.1109/ltb-3d.2014.6886147","DOIUrl":null,"url":null,"abstract":"This paper describes low temperature direct bond technology and applications enabled by this technology. This technology includes ZiBond® and DBI® hybrid bonding. Enabled applications include backside illuminated (BSI) image sensors; stacked BSI image sensors; DBI® hybrid bond image sensors; 3D memory; higher performance, lower cost RF front ends; and reduced thickness, lower cost die stacks with reduced stress.","PeriodicalId":123514,"journal":{"name":"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ltb-3d.2014.6886147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper describes low temperature direct bond technology and applications enabled by this technology. This technology includes ZiBond® and DBI® hybrid bonding. Enabled applications include backside illuminated (BSI) image sensors; stacked BSI image sensors; DBI® hybrid bond image sensors; 3D memory; higher performance, lower cost RF front ends; and reduced thickness, lower cost die stacks with reduced stress.