Achieving a world record in ultra high speed wire bonding through novel technology

Abstract

The traditional wire bonder design employs a pivoting z-axis, which is mounted on an orthogonal x/y-stage. This type of system is now approaching its physical limitations. The new revolutionary and unique bond head design described in this paper uses entirely new kinematics, which allows for higher accelerations, as well as a stiff, light design. The vibrations, even at highest speed, can be reduced to a level that is not conceivable with conventional designs. These equipment capabilities can be used to redefine process-related issues, such as looping, and ball and wedge formation, where low vibrations at high speed are crucial. This new technology achieved a world record in high-speed wire bonding in the lab and leads to a UPH increase of more than 60% with respect to today's conventional best class designs. The benefit of this revolutionary design for the back end manufacturer is the prolonged life expectancy of wire bonding, as the standard interconnect technology. Manufacturers will continue to realize cost savings through productivity improvements and reduce their risk by remaining with a standard that has flourished for decades.