Package test interface fixture considering low cost solution, high electrical performance, and compatibility with fine pitch packages

Ki-Jae Song, Hunkyo Seo, Sang-hyun Ko
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引用次数: 1

Abstract

This paper introduces the package test interface fixture with low cost test topology, high electrical performances, and compatibility with fine pitch packages. The proposed fixture demonstrates electrical performance using special jig and mobile DDR2.
封装测试接口夹具考虑低成本解决方案,高电气性能,并与小间距封装兼容
本文介绍了一种测试拓扑成本低、电气性能高、可兼容小间距封装的封装测试接口夹具。该夹具采用专用夹具和移动DDR2进行电气性能验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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