A front-illuminated stacked global-shutter CMOS image sensor with multiple chip-on-chip integration

Abstract

A front-illuminated global-shutter CMOS image sensor has been developed with super 35-mm optical format. We have developed a chip-on-chip integration process to realize a front-illuminated image sensor stacked with 2 diced logic chips through 38K micro bump interconnections. The global-shutter pixel achieves a parasitic light sensitivity of −99.6dB. The stacked device allows highly parallel column ADCs and high-speed output interfaces to attain a frame rate of 480 fps with 8.3M-pixel resolution.