A Deterministic-Statistical Multiple-Defect Diagnosis Methodology

Soumya Mittal, R. D. Blanton
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Abstract

Software diagnosis is the process of locating and characterizing a defect in a failing chip. It is the cornerstone of failure analysis that consequently enables yield learning and monitoring. However, multiple-defect diagnosis is challenging due to error masking and unmasking effects, and exponential complexity of the solution search process. This paper describes a three-phase, physically-aware diagnosis methodology called MDLearnX to effectively diagnose multiple defects, and in turn, aid in accelerating the design and process development. The first phase identifies a defect that resembles traditional fault models. The second and the third phases utilize the X-fault model and machine learning to identify correct candidates. Results from a thorough fault injection and simulation experiment demonstrate that MD-LearnX returns an ideal diagnosis 2X more often than commercial diagnosis. Its effectiveness is further evidenced through a silicon experiment, where, on average, MD-LearnX returns 5.3 fewer candidates per diagnosis as compared to state-of-the-art commercial diagnosis without losing accuracy.
一种确定性统计多缺陷诊断方法
软件诊断是对故障芯片中的缺陷进行定位和表征的过程。它是故障分析的基础,从而实现产量的学习和监控。然而,由于误差掩蔽和解掩蔽效应以及解搜索过程的指数复杂度,多缺陷诊断具有挑战性。本文描述了一种称为MDLearnX的三阶段物理感知诊断方法,以有效地诊断多种缺陷,并反过来帮助加速设计和过程开发。第一阶段识别类似于传统故障模型的缺陷。第二和第三阶段利用X-fault模型和机器学习来识别正确的候选者。彻底的故障注入和仿真实验结果表明,MD-LearnX的理想诊断率比商业诊断高2倍。通过硅实验,MD-LearnX的有效性得到了进一步的证明,与最先进的商业诊断相比,MD-LearnX在不失去准确性的情况下,每次诊断的候选结果平均减少了5.3个。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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