Wire bonding tip study for extremely ESD sensitive devices

Abstract

Ultrasonic bonding tools are used extensively in many industries. This study will examine the mechanism of Ultrasonic wire bonding & the effects of ESD charge removal using a common ceramic material spread into 3 different resistances groups and recording the behavior. Our purpose is to examine the bonding tool's ability to control - voltage and characterize their respective dissipation rates for the purpose of determining an optimum process window. Experimentation will show the positive & negative effects of typical tools in use today as mechanical bonding tools. An analysis is shown of the effectiveness of the tip in simulating the dissipating voltage away from a floating GMR head. We will examine their ability to discharge voltage from devices and reduce ESD currents.