High-speed optical three dimensional measurement method for micro bump inspection in 3D LSI chip stacking technology

M. Aoyagi, N. Watanabe, K. Kikuchi, S. Nemoto, Noriaki Arima, M. Ishizuka, Koji Suzuki, Toshio Shiomi
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Abstract

3D LSI chip stacking technology has been developed in AIST using cone shape micro bumps fabricated by nanoparticle deposition method. The cone shape bumps are suitable for a thermocompression bump joint process with low temperature and low load force, where the bumps are easy to collapse with loading due to the pointed structure. High yield micro bump joints can be obtained. The three dimensional measurement of the cone shape bumps can be done using laser scanning microscope or scanning electron beam microscope. It is not suitable for a mass production inspection test. We have proposed a new optical three dimensional structure measurement technique using optical microscopes with image sensors or line sensors. We developed recently a high-speed optical three dimensional measurement system using specially manufactured optical microscopes with high-speed 8192-pixel line sensors, which can be used for a mass-production process line. Blue laser diffused illumination was equipped to obtain a high resolution. The cone shape bump height measurement with standard deviation less than 0.3 μm was confirmed. The high-speed wafer measurement was demonstrated using 10 μm diameter Cu pillar bumps.
三维LSI芯片堆叠技术中微碰撞检测的高速光学三维测量方法
AIST采用纳米颗粒沉积法制备锥形微凸块,开发了三维LSI芯片堆叠技术。锥形凸点适用于低温、低载荷力的热压凸点接头工艺,由于凸点的尖头结构,容易随载荷坍塌。可以获得高产量的微凹凸接头。锥形凸起的三维测量可以用激光扫描显微镜或扫描电子束显微镜进行。不适合批量生产检验试验。我们提出了一种新的光学三维结构测量技术,使用带有图像传感器或线传感器的光学显微镜。我们最近开发了一种高速光学三维测量系统,该系统使用特制的光学显微镜和高速8192像素线传感器,可用于批量生产生产线。采用蓝色激光漫射照明,获得高分辨率。验证了圆锥形凸起高度测量的标准偏差小于0.3 μm。采用直径为10 μm的铜柱凸点进行高速晶圆测量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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