An electromagnetic model for back-drilled vias

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2015-12-07 DOI:10.1109/EPEPS.2015.7347127

A. Rong, A. Cangellaris, Feng Ling

引用次数: 0

Abstract

The Foldy-Lax formulation for the electromagnetic modeling of planar, multilayered substrates with multiple pins and vias is extended to include the presence of back-drilled via holes. A validation study of the accuracy of the proposed model is also presented.

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后钻过孔的电磁模型

用于具有多个引脚和过孔的平面多层基板的电磁建模的fold - lax公式被扩展到包括背钻过孔的存在。对所提出的模型的准确性进行了验证研究。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)

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