New Hot-Carrier Lifetime Technique for High- to Low-Supplied Voltage nMOSFETs

C. Guérin, C. Parthasarathy, V. Huard, A. Bravaix
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引用次数: 5

Abstract

In this paper, we propose to distinguish the distinct carrier degradation modes as a function of the energy range developing a complete lifetime extrapolation technique down to the low voltage operation. This provides a starting point of a more accurate modeling of CHC effects during product operations. This work shows that CHC effects in nMOSFET consist in three different regimes depending on the gate voltage (Vg). A simple way to extrapolate lifetime at nominal bias conditions from data get under accelerated stress conditions was detailed for each regime. We also propose an answer to the contradictory debate of the respective contributions of electron-electron scattering (EES) (Rauch et al., 2001) and the multiple vibrational excitation (MVE) (Hess et al., 1999) to CHC effects in the low energy range.
高低压nmosfet热载流子寿命新技术
在本文中,我们建议区分不同的载流子退化模式作为能量范围的函数,开发一个完整的寿命外推技术,直到低电压操作。这为在产品操作过程中更准确地模拟CHC效应提供了一个起点。这项工作表明,nMOSFET中的CHC效应根据栅电压(Vg)分为三种不同的状态。从加速应力条件下获得的数据中,详细介绍了一种简单的方法来推断在名义偏置条件下的寿命。对于电子-电子散射(EES) (Rauch et al., 2001)和多重振动激发(MVE) (Hess et al., 1999)在低能量范围内对CHC效应的各自贡献的矛盾争论,我们也提出了一个答案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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