NBTI-channel hot carrier effects in PMOSFETs in advanced CMOS technologies

G. La Rosa, F. Guarín, S. Rauch, A. Acovic, J. Lukaitis, E. Crabbé
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引用次数: 89

Abstract

In this work the reliability of a 0.35 /spl mu/m p+ poly-gate pMOSFET CMOS technology under conductive channel hot carrier conditions is investigated. It is found that at any bias and temperature condition applied, the degradation of sufficiently short channel length (Leff/spl sime/0.14 um) devices results in a reduction in drive current due to the impact of donor type interface trap generation and positive charge formation during the stress. At these dimensions the degradation is controlled by a contribution of both Negative Bias Temperature Instability (NBTI) and Channel Hot Carrier (CHC) mechanism. We will show the role that each of these two mechanisms play in determining the shift of typical device parameters. A methodology to decouple the two effects is also provided allowing to quantify each contribution separately at any bias and temperature condition. A conductive CHC model that takes into account the impact of both mechanisms to the device lifetime at the worst observed degradation condition (Vg=Vd) is also discussed.
先进CMOS技术中pmosfet的nbti通道热载子效应
本文研究了导电通道热载流子条件下0.35 /spl mu/m p+多栅极pMOSFET CMOS技术的可靠性。研究发现,在任何偏置和温度条件下,足够短的通道长度(Leff/spl sime/0.14 um)器件的退化会导致驱动电流的减少,这是由于施主型界面陷阱的产生和应力过程中正电荷形成的影响。在这些维度上,降解是由负偏置温度不稳定性(NBTI)和通道热载流子(CHC)机制共同控制的。我们将展示这两种机制中的每一种在确定典型器件参数的移位时所起的作用。还提供了一种解耦两种影响的方法,允许在任何偏置和温度条件下分别量化每种贡献。一个导电CHC模型,考虑到这两种机制对器件寿命的影响,在最坏的观察退化条件(Vg=Vd)也进行了讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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