Evaluation of 600 V/100 A NPT-IGBT with a non-self-align shallow p-well formation techniques

Abstract

Experimental results of planer gate IGBTs fabricated with newly developed a non-self-align shallow p-well formation technique are presented. The 600 V/100 A NPT-IGBT shows the on-state voltage drop of about 1.7 V, which is more than 0.4 V reduction compared to the conventional devices. The average short circuit withstand capability of about 30 /spl mu/sec was obtained without external current limiting functions.