A. G. Boon, Chan Choon Kit, C. Keng, Oh Chong Khiam
{"title":"TetraMax Diagnosis and Laker Software on Failure Analysis For ATPG/Scan Failures","authors":"A. G. Boon, Chan Choon Kit, C. Keng, Oh Chong Khiam","doi":"10.1109/IPFA.2006.251034","DOIUrl":null,"url":null,"abstract":"Scan/ATPG failures have been one of the main failures contributing to low yield issues and problems in microelectronics. In this paper, the beauty of the TetraMax diagnosis together with the Laker diagnosis software which serve as a complement was discussed, as they are one of the key diagnosis tools currently in the industry to analyze the scan/ATPG failures. The concept of the scan test, the files required to run TetraMax diagnosis, the use of the generated failing nets to convert into failing paths as well as the capability of the Laker software in identifying the particular suspected defective metal, via, poly, contact, active line in the failing path will be discussed together with case studies to illustrate it. This paper served as a useful reading material to wafer fabrication that has the intention of developing such capability in resolving their ATPG/scan failure issues","PeriodicalId":283576,"journal":{"name":"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"238 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2006.251034","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Scan/ATPG failures have been one of the main failures contributing to low yield issues and problems in microelectronics. In this paper, the beauty of the TetraMax diagnosis together with the Laker diagnosis software which serve as a complement was discussed, as they are one of the key diagnosis tools currently in the industry to analyze the scan/ATPG failures. The concept of the scan test, the files required to run TetraMax diagnosis, the use of the generated failing nets to convert into failing paths as well as the capability of the Laker software in identifying the particular suspected defective metal, via, poly, contact, active line in the failing path will be discussed together with case studies to illustrate it. This paper served as a useful reading material to wafer fabrication that has the intention of developing such capability in resolving their ATPG/scan failure issues